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OEG MR200 micro diamond scriber

Overview:

The MR200 is a micro diamond scriber. It is equipped with a diamond point that is used for cutting structured silicon wafers accurately.  The cutting strength can be adjusted.

Applications:

Cutting samples and wafers with high precision.

Specifications:

Maximum sample size: 200 x 200 mm
Wafer thickness: up to 2 mm
Materials: silicon, sapphire, glass, quartz.

Superuser:

Pia Bomholt Jensen