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LANZ VPO 50

Overview:

Hexamethyldisilasan (HMDS) wafer priming for superior adhesion of resists to silicon and other substrates.

Applications:

HMDS wafer priming is an integral part of photoresist processing for photolithography. Without an HMDS process, photoresist can detach during critical steps of the photolithography process.

Superuser:

Bjarke Rolighed Jeppesen