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EVG 610 mask aligner



The EVG610 is a highly flexible research and development system that can handle small substrate pieces and wafers up to 100 mm. It supports a variety of standard lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, and allow front-side and back-side alignment.


Mask aligner for alignment and UV exposure of resist coated substrates. It patterns photoresists. The patterns are subsequently transferred into structural elements using other instruments in the facility.


Alignment resolution: 0.5 µm
Pattern resolution: <0.8 µm in vacuum contact, ≥ 2 µm in proximity
Mercury arc lamp: 500W Near UV
Mask size: 5 inch
Wafer diameter: Pieces and 100 mm wafers.


Bjarke Rolighed Jeppesen