Document Responsible: Bjarke Rolighed
Date: 17 June 2021
The purpose of this APV instruction is to ensure that users, in the iNANO cleanroom, are aware of the potential dangers that exist when working with the EVG501 Wafer Bonding System. Users should be aware of the potential hazards listed below. The aim of this APV instruction is also to prevent personal injury to maintenance personnel.
The instrument performs wafer bonding processes. Wafers are first aligned and then put on a bond chuck.The wafers, together with the bond chuck are placed into the bond chamber. A piston is used to press wafers together during a bonding process with up to 10kN force.
Maintenance personnel must be aware of, and act accordingly to, local conditions of compressed nitrogen and air.
A cleanroom suit and gloves must be worn when handling the process chamber and associated components.
The following chemicals can be found in the EVG501 Wafer Bonding System:
Non-toxic: N2, compressed dry air.
Potentially lethal voltages are present inside the equipment. To prevent personal injury, ensure the system, circuit or component is isolated from its source of supply prior to undertaking any maintenance or repair of the equipment. Do not rely on control system interlocks or display messages as an indication that it is safe to work on potentially hazardous items.