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APV for EVG501 Wafer Bonding System 


Document Responsible: Bjarke Rolighed 

Date: 15-03-2018 


1) Purpose/Formål 

The purpose of this APV instruction is to ensure that employees at iNANO are aware of the potential dangers that exist when working with the EVG501 Wafer Bonding System located inside the cleanroom facility. The aim of this APV instruction is also to prevent personal injury to maintenance personnel of the EVG501 Wafer Bonding System. All users who work on the EVG501 Wafer Bonding System should be aware of the potential hazards listed. 


2) The Instrument/Instrumentet 

The instrument performs wafer bonding processes. Wafers are first aligned and then put on a bond chuck.The wafers, together with the bond chuck are placed into the bond chamber. A piston is used to press wafers together during a bonding process with up to 10kN force. 


3) Hazardous Conditions/Risiko 

Maintenance personnel must be aware of, and act accordingly to, local conditions of compressed nitrogen and air. 


4) Protective Clothing/Beskyttelsesdragt 

As a minimum requirement a cleanroom suit, gloves should be worn when handling process chamber and associated components. 


5) Identification/Identifikation 

The following chemicals can be found in the EVG501 Wafer Bonding System: 

Toxic: none 

Non-toxic: N2, compressed dry air. 


6) Electrical Safety/ El sikkerhed 

Potentially lethal voltages are present inside the equipment. To prevent personal injury, ensure the system, circuit or component is isolated from its source of supply prior to undertaking any maintenance or repair of the equipment. Do not rely on control system interlocks or display messages as an indication that it is safe to work on potentially hazardous items.