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LANZ VPO 50

Overview:

Hexamethyldisilasan (HMDS) wafer priming for superior adhesion of resists to silicon and other substrates.

Applications:

It is an integral part of photoresist processing for photolithography. Without an HMDS process, photoresist would fall off during critical steps of the photolithography process.

Superuser:

Pia Bomholt Jensen