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Reactive ion etcher (RIE)


The instrument is for reactive ion etching (RIE). Oxygen or argon plasma can be used for cleaning samples, dry etching of polymers and plasma activation/modification of surfaces. The instrument is equipped with a turbo pump that ensures short pumping times and high throughput.


Surface cleaning. Etching of polymers. Plasma activation.


Sample size: up to 280 mm diameter
Processing gasses: O2, Ar
Maximum power: 600 W


Bjarke Rolighed Jeppesen