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Reactive ion etcher (RIE)

Overview:

The equipment is for reactive ion etching (RIE) in microfabrication. Oxygen or argon plasma can be used for cleaning samples and dry etching of polymers. The machine is equipped with a turbo pump that ensures short pumping times and high throughput.

Applications:

Surface cleaning. Etching of polymers.

Specifications:

Sample size: up to 280 mm in diameter
Processing gasses: O2, Ar
Maximum power: 600 W

Superuser:

Andreas Søe Andersen